The following is an abstract for the selected article. A PDF download of the full text of this article is available here. Members may download full texts at no charge. Non-members may be charged a small fee for certain articles.

Aluminum, Titanium Boride, and Nitride Films Sputter-Deposited from Multicomponent Alloy Targets Studied by XPS

Volume 47, Number 1 (Jan. 1993) Page 35-37

Onyiriuka, Emmanuel C.

X-ray photoelectron spectroscopy (XPS or ESCA), combined with argonion sputter depth profiling, has been employed for the characterization of aluminum, titanium boride, and nitride films deposited by dc-magnetron sputtering from multicomponent alloy targets. The XPS results show that metallic Al, TiB2, and TiN films are formed by this method. However, depth profile results indicated substantial oxide contamination as high as 30 atomic % throughout the bulk of the films. Given the gross oxide contamination, multicomponent alloy target materials appear to be unsuitable for producing high-quality metal/metallic films for applications where electrical conductivity is a critical requirement.